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Kinsus Interconnect Technology

SemiconductorsActiveXinwu District, TaiwanFounded 2000Website ↗

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  1. Intel, AMD Jump 12%+ on TSMC's New Chip-Packaging TechIntel shares jumped about 12% and TSMC gained nearly 7% after a report that TSMC is developing an advanced chip-packaging technology resembling Intel's EMIB approach, partnering with Taiwan's Kinsus Interconnect Technology.→

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  1. Jul 30, 2026AIIntel, AMD Jump 12%+ on TSMC's New Chip-Packaging TechIntel +12%, TSMC +7%→

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Intel, AMD Jump 12%+ on TSMC's New Chip-Packaging Tech

Illustration for: Intel, AMD Jump 12%+ on TSMC's New Chip-Packaging Tech
AIIntel +12%, TSMC +7%

Intel, AMD Jump 12%+ on TSMC's New Chip-Packaging Tech

Intel shares jumped about 12% and TSMC gained nearly 7% after a report that TSMC is developing an advanced chip-packaging technology resembling Intel's EMIB approach, partnering with Taiwan's Kinsus Interconnect Technology.

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